Inventor
SHIH HSIN-CHING
TW3 patents
Patents
3 patentsUS7122484B2Oct 17, 2006
Process for removing organic materials during formation of a metal interconnect
TAIWAN SEMICONDUCTOR MFG19 citations90
US6797627B1Sep 28, 2004
Dry-wet-dry solvent-free process after stop layer etch in dual damascene process
TAIWAN SEMICONDUCTOR MFG35 citations88
US6974505B2Dec 13, 2005
Tool for cleaning substrates
TAIWAN SEMICONDUCTOR MFG4 citations56