Inventor
HSIEH MING-HONG
TW12 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH MING-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS11616002B2Mar 28, 2023
Through-circuit vias in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12154838B2Nov 26, 2024
Semiconductor arrangement and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12293959B2May 6, 2025
Through-circuit Vias in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12243805B2Mar 4, 2025
Through-circuit vias in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12131992B2Oct 29, 2024
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11830806B2Nov 28, 2023
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9875964B2Jan 23, 2018
Semiconductor device components and methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
TAIWAN SEMICONDUCTOR MFG
4 patentsUS6999081B1Feb 14, 2006
Method and apparatus for displaying production data for improved manufacturing decision making
TAIWAN SEMICONDUCTOR MFG11 citations82
US7217663B2May 15, 2007
Via hole and trench structures and fabrication methods thereof and dual damascene structures and fabrication methods thereof
TAIWAN SEMICONDUCTOR MFG7 citations73
US6974505B2Dec 13, 2005
Tool for cleaning substrates
TAIWAN SEMICONDUCTOR MFG4 citations56
US7436009B2Oct 14, 2008
Via structures and trench structures and dual damascene structures
TAIWAN SEMICONDUCTOR MFG0 citations51