Inventor
LIN HUNG-TSUN
TW9 patents
⚠️ This page may combine multiple inventors who share the name “LIN HUNG-TSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
5 patentsUS7663246B2Feb 16, 2010
Stacked chip packaging with heat sink structure
CHIPMOS TECHNOLOGIES INC22 citations92
US7582953B2Sep 1, 2009
Package structure with leadframe on offset chip-stacked structure
CHIPMOS TECHNOLOGIES INC16 citations82
US7479706B2Jan 20, 2009
Chip package structure
CHIPMOS TECHNOLOGIES INC2 citations60
US8026615B2Sep 27, 2011
IC package reducing wiring layers on substrate and its carrier
CHIPMOS TECHNOLOGIES INC0 citations50
US7781898B2Aug 24, 2010
IC package reducing wiring layers on substrate and its chip carrier
CHIPMOS TECHNOLOGIES INC0 citations50
CHIPMOS TECHNOLOGIES BERMUDA
4 patentsUS7662672B2Feb 16, 2010
Manufacturing process of leadframe-based BGA packages
CHIPMOS TECHNOLOGIES BERMUDA20 citations90
US7952198B2May 31, 2011
BGA package with leads on chip
CHIPMOS TECHNOLOGIES BERMUDA7 citations82
US7879653B2Feb 1, 2011
Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
CHIPMOS TECHNOLOGIES BERMUDA4 citations60
US7579676B2Aug 25, 2009
Leadless leadframe implemented in a leadframe-based BGA package
CHIPMOS TECHNOLOGIES BERMUDA5 citations60