Inventor

TAN KIAN SHING

SG2 patents

Patents

2 patents

US6737606B2May 18, 2004

Wafer dicing device and method

MICRON TECHNOLOGY INC51 citations91

US7691680B2Apr 6, 2010

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

MICRON TECHNOLOGY INC0 citations46