Inventor
TATEYAMA YOSHIKUNI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “TATEYAMA YOSHIKUNI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
12 patentsUS5664989ASep 9, 1997
Polishing pad, polishing apparatus and polishing method
TOSHIBA KK74 citations96
US7042099B2May 9, 2006
Semiconductor device containing a dummy wire
TOSHIBA KK35 citations92
US6858936B2Feb 22, 2005
Semiconductor device having an improved construction in the interlayer insulating film
TOSHIBA KK15 citations92
US6561876B1May 13, 2003
CMP method and semiconductor manufacturing apparatus
TOSHIBA KK43 citations92
US7144804B2Dec 5, 2006
Semiconductor device and method of manufacturing the same
TOSHIBA KK6 citations74
US7521350B2Apr 21, 2009
Manufacturing method of a semiconductor device
TOSHIBA KK4 citations63
US7452819B2Nov 18, 2008
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
TOSHIBA KK3 citations63
US6984582B2Jan 10, 2006
Method of making semiconductor device by polishing with intermediate clean polishing
TOSHIBA KK5 citations63
US7101801B2Sep 5, 2006
Method of manufacturing semiconductor device using chemical mechanical polishing
TOSHIBA KK5 citations62
US7951717B2May 31, 2011
Post-CMP treating liquid and manufacturing method of semiconductor device using the same
TOSHIBA KK0 citations52
US7888139B2Feb 15, 2011
Fabricating method of nonvolatile semiconductor storage apparatus
TOSHIBA KK0 citations52
US7985685B2Jul 26, 2011
Method of manufacturing semiconductor device
TOSHIBA KK0 citations40
EBARA CORP
5 patentsUS6036582AMar 14, 2000
Polishing apparatus
EBARA CORP61 citations96
US6645053B1Nov 11, 2003
Polishing apparatus
EBARA CORP17 citations84
US6835116B2Dec 28, 2004
Polishing apparatus
EBARA CORP17 citations82
US7883394B2Feb 8, 2011
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
EBARA CORP5 citations73
US7419420B2Sep 2, 2008
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
EBARA CORP5 citations73