Inventor
PARK SUNG SU
KR35 patents
⚠️ This page may combine multiple inventors who share the name “PARK SUNG SU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUSD768191SOct 4, 2016
Display screen or portion thereof with icon
SAMSUNG ELECTRONICS CO LTD30 citations92
US5502872AApr 2, 1996
Electric vacuum cleaner having steam discharge and cloth wiper
SAMSUNG ELECTRONICS CO LTD92 citations91
USD758108SJun 7, 2016
Display unit
SAMSUNG ELECTRONICS CO LTD15 citations82
US9691358B2Jun 27, 2017
Electronic apparatus and method for outputting content
SAMSUNG ELECTRONICS CO LTD3 citations71
USD758109SJun 7, 2016
Display unit
SAMSUNG ELECTRONICS CO LTD5 citations71
USD757468SMay 31, 2016
Display unit
SAMSUNG ELECTRONICS CO LTD2 citations61
US10685624B2Jun 16, 2020
Electronic apparatus and method for outputting content
SAMSUNG ELECTRONICS CO LTD1 citations60
US10592071B2Mar 17, 2020
Multi-display system, electronic device, and content output method
SAMSUNG ELECTRONICS CO LTD0 citations51
US9025781B2May 5, 2015
Sound quality evaluation apparatus and method thereof
SAMSUNG ELECTRONICS CO LTD2 citations51
USD757467SMay 31, 2016
Display unit
SAMSUNG ELECTRONICS CO LTD0 citations50
USD756691SMay 24, 2016
Display unit
SAMSUNG ELECTRONICS CO LTD0 citations50
USD752371SMar 29, 2016
Display unit
SAMSUNG ELECTRONICS CO LTD0 citations50
AMKOR TECHNOLOGY INC
9 patentsUS7843072B1Nov 30, 2010
Semiconductor package having through holes
AMKOR TECHNOLOGY INC103 citations97
US7335986B1Feb 26, 2008
Wafer level chip scale package
AMKOR TECHNOLOGY INC57 citations96
US7042072B1May 9, 2006
Semiconductor package and method of manufacturing the same which reduces warpage
AMKOR TECHNOLOGY INC90 citations95
US7633763B1Dec 15, 2009
Double mold memory card and its manufacturing method
AMKOR TECHNOLOGY INC20 citations92
US7446422B1Nov 4, 2008
Wafer level chip scale package and manufacturing method for the same
AMKOR TECHNOLOGY INC26 citations92
US6936922B1Aug 30, 2005
Semiconductor package structure reducing warpage and manufacturing method thereof
AMKOR TECHNOLOGY INC49 citations92
US6833619B1Dec 21, 2004
Thin profile semiconductor package which reduces warpage and damage during laser markings
AMKOR TECHNOLOGY INC26 citations92
US7220915B1May 22, 2007
Memory card and its manufacturing method
AMKOR TECHNOLOGY INC18 citations83
US7201327B1Apr 10, 2007
Memory card and its manufacturing method
AMKOR TECHNOLOGY INC7 citations73
(unassigned)
3 patentsSK HYNIX INC
3 patentsUS9158081B2Oct 13, 2015
Semiconductor package with an optical signal path, memory card including the same, and electronic system including the same
SK HYNIX INC8 citations78
US9536846B2Jan 3, 2017
Semiconductor devices having through electrodes, methods of fabricating the same, electronic systems including the same, and memory cards including same
SK HYNIX INC5 citations72
US10109545B2Oct 23, 2018
Semiconductor devices having through electrodes and methods of manufacturing the same
SK HYNIX INC0 citations39