Inventor
KIM SUNG-HYUP
KR13 patents
Patents
13 patentsUS11127654B2Sep 21, 2021
Semiconductor device and a manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD5 citations79
US12051601B2Jul 30, 2024
Method of bonding substrates utilizing a substrate holder with holding fingers
SAMSUNG ELECTRONICS CO LTD2 citations72
US11640912B2May 2, 2023
Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates
SAMSUNG ELECTRONICS CO LTD2 citations72
US10811287B2Oct 20, 2020
Spin coater and substrate treating apparatus having the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US9791855B2Oct 17, 2017
Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor
SAMSUNG ELECTRONICS CO LTD2 citations71
US10971379B2Apr 6, 2021
Wafer bonding apparatus and wafer bonding system using the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10763243B2Sep 1, 2020
Substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD1 citations60
US7792453B2Sep 7, 2010
Image forming apparatus with opening/closing member
SAMSUNG ELECTRONICS CO LTD4 citations59
US12199014B2Jan 14, 2025
Semiconductor device and a manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations58
US12513810B2Dec 30, 2025
EUV generator, EUV lithography apparatus including the same, and method for fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10811381B2Oct 20, 2020
Wafer to wafer bonding method and wafer to wafer bonding system
SAMSUNG ELECTRONICS CO LTD0 citations49
US10295564B2May 21, 2019
Apparatus for clamping a probe card and probe card including the same
SAMSUNG ELECTRONICS CO LTD0 citations48
US10937670B2Mar 2, 2021
Megasonic cleaner
SAMSUNG ELECTRONICS CO LTD0 citations42