Inventor
SAITO HARUHISA
JP16 patents
⚠️ This page may combine multiple inventors who share the name “SAITO HARUHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BANDAI CO
8 patentsUS9798905B2Oct 24, 2017
Information bearing medium and information processing system
BANDAI CO3 citations83
US9495565B2Nov 15, 2016
Information bearing medium and information processing system
BANDAI CO3 citations83
US9202090B2Dec 1, 2015
Information bearing medium and information processing system
BANDAI CO6 citations83
US10747965B2Aug 18, 2020
Information bearing medium and information processing system
BANDAI CO1 citations72
US10528773B2Jan 7, 2020
Information bearing medium and information processing system
BANDAI CO2 citations72
US10210354B2Feb 19, 2019
Information bearing medium and information processing system
BANDAI CO2 citations72
US10013586B2Jul 3, 2018
Information bearing medium and information processing system
BANDAI CO2 citations72
US11250223B2Feb 15, 2022
Information bearing medium and information processing system
BANDAI CO0 citations61
OLYMPUS CORP
8 patentsUS10644059B2May 5, 2020
Solid-state imaging device and imaging apparatus
OLYMPUS CORP2 citations72
US9478520B2Oct 25, 2016
Solid-state imaging device, imaging apparatus, substrate, semiconductor device and method of manufacturing the solid-state imaging device
OLYMPUS CORP3 citations72
US9343498B2May 17, 2016
Semiconductor device, imaging device and semiconductor device manufacturing method
OLYMPUS CORP6 citations72
US8847296B2Sep 30, 2014
Solid-state imaging device, imaging apparatus, substrate, semiconductor device and method of manufacturing the solid-state imaging device
OLYMPUS CORP1 citations51
US9230884B2Jan 5, 2016
Semiconductor device
OLYMPUS CORP0 citations41
US8963346B2Feb 24, 2015
Semiconductor wafer and semiconductor device
OLYMPUS CORP0 citations41
US10056344B2Aug 21, 2018
Semiconductor device
OLYMPUS CORP0 citations40
US9954027B2Apr 24, 2018
Image pickup device and manufacturing method for image pickup device by stacking/bonding of crystalline silicon substrates
OLYMPUS CORP0 citations40