Inventor

TING KAI-YUAN

US20 patents

⚠️ This page may combine multiple inventors who share the name “TING KAI-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TING KAI-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

System and method for ESL modeling of machine learning

Function safety and fault management modeling at electrical system level (ESL)

System and method for validating stacked dies by comparing connections

System and method for ESL modeling of machine learning

System and method for ESL modeling of machine learning

Dynamic frequency scaling

Function safety and fault management modeling at electrical system level (ESL)

Function safety and fault management modeling at electrical system level (ESL)

Power estimation

Power estimation

System and method of adaptive voltage frequency scaling

System and method for functional verification of multi-die 3D ICs

System and method for validating stacked dies by comparing connections

Processor power estimation

Electrical system level (ESL) battery discharge simulation

System and method for system-level parameter estimation

MEHTA ASHOK

Stacked die interconnect validation

Format conversion from value change dump (VCD) to universal verification methodology (UVM)

TING KAI YUAN

Dynamic frequency scaling

JOHN STANLEY

System and method for functional verification of multi-die 3D ICs