Inventor · disambiguated record
Vijay K. Nair
Also filed as: NAIR VIJAY · NAIR VIJAY K
56 granted patents·11 pending applications·706 citations·filing 1990–2022
98Inventor score
Top patents by PatentIndex Score
67 records- 0197US11387200B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 0297US9281292B2Single layer low cost wafer level packaging for SFF SiPHU CHUAN·Filed 2012·Granted Mar 8, 2016·54 cites·20 claims
- 0396US8890628B2Ultra slim RF package for ultrabooks and smart phonesNAIR VIJAY K·Filed 2012·Granted Nov 18, 2014·72 cites·29 claims
- 0495US11978948B2Die with embedded communication cavityINTEL CORP·Filed 2021·Granted May 7, 2024·2 cites·19 claims
- 0594US6605454B2Microfluidic devices with monolithic microwave integrated circuitsMOTOROLA INC·Filed 2001·Granted Aug 12, 2003·156 cites·10 claims
- 0692US11206008B2Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator diesINTEL CORP·Filed 2017·Granted Dec 21, 2021·7 cites·25 claims
- 0792US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 0892US10439671B2Microelectronic devices designed with high frequency communication modules having steerable beamforming capabilityINTEL CORP·Filed 2015·Granted Oct 8, 2019·10 cites·20 claims
- 0992US10291283B2Tunable radio frequency systems using piezoelectric package-integrated switching devicesINTEL CORP·Filed 2016·Granted May 14, 2019·6 cites·22 claims
- 1092US10122089B2Magnetic nanocomposite materials and passive components formed therewithINTEL CORP·Filed 2016·Granted Nov 6, 2018·7 cites·7 claims
- 1192US9461355B2Method apparatus and material for radio frequency passives and antennasNAIR VIJAY K·Filed 2013·Granted Oct 4, 2016·14 cites·29 claims
- 1289US10887439B2Microelectronic devices designed with integrated antennas on a substrateINTEL CORP·Filed 2015·Granted Jan 5, 2021·5 cites·18 claims
- 1389US10410983B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on packageINTEL CORP·Filed 2015·Granted Sep 10, 2019·6 cites·20 claims
- 1488US10867961B2Single layer low cost wafer level packaging for SFF SiPINTEL CORP·Filed 2018·Granted Dec 15, 2020·4 cites·20 claims
- 1588US10629551B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Apr 21, 2020·5 cites·19 claims
- 1688US8891246B2System-in-package using embedded-die coreless substrates, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Nov 18, 2014·10 cites·34 claims
- 1786US10546835B2Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Jan 28, 2020·4 cites·16 claims
- 1886US9647636B1Piezoelectric package-integrated delay lines for radio frequency identification tagsINTEL CORP·Filed 2016·Granted May 9, 2017·4 cites·26 claims
- 1985US11456721B2RF front end module including hybrid filter and active circuits in a single packageINTEL CORP·Filed 2017·Granted Sep 27, 2022·4 cites·28 claims
- 2085US10483250B2Three-dimensional small form factor system in package architectureINTEL CORP·Filed 2015·Granted Nov 19, 2019·5 cites·25 claims
- 2185US8369796B2Multi-band tunable frequency reconfigurable antennas using higher order resonancesINTEL CORP·Filed 2006·Granted Feb 5, 2013·16 cites·14 claims
- 2284US5506544ABias circuit for depletion mode field effect transistorsMOTOROLA INC·Filed 1995·Granted Apr 9, 1996·56 cites·19 claims
- 2383US5939941AHigh efficiency power amplifier using HITFET driver circuitMOTOROLA INC·Filed 1997·Granted Aug 17, 1999·55 cites·16 claims
- 2482US11128029B2Die with embedded communication cavityINTEL CORP·Filed 2016·Granted Sep 21, 2021·3 cites·16 claims
- 2580US11488880B2Enclosure for an electronic componentINTEL CORP·Filed 2017·Granted Nov 1, 2022·3 cites·23 claims
- 2680US9991239B2Method of embedding WLCSP components in e-WLB and e-PLBINTEL CORP·Filed 2014·Granted Jun 5, 2018·4 cites·18 claims
- 2779US10903818B2Piezoelectric package-integrated film bulk acoustic resonator devicesINTEL CORP·Filed 2016·Granted Jan 26, 2021·3 cites·26 claims
- 2878US10147710B2Method of embedding WLCSP components in E-WLB and E-PLBINTEL CORP·Filed 2018·Granted Dec 4, 2018·2 cites·7 claims
- 2978US10014277B2Single layer low cost wafer level packaging for SFF SiPINTEL CORP·Filed 2016·Granted Jul 3, 2018·2 cites·19 claims
- 3076US11335651B2Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabricINTEL CORP·Filed 2015·Granted May 17, 2022·2 cites·14 claims
- 3176US8077095B2Multi-band highly isolated planar antennas integrated with front-end modules for mobile applicationsSUH SEONG-YOUP·Filed 2007·Granted Dec 13, 2011·9 cites·21 claims
- 3275US11195806B2High frequency waveguide structureINTEL CORP·Filed 2016·Granted Dec 7, 2021·2 cites·20 claims
- 3374US11037892B2Substrate dielectric waveguides in semiconductor packagesINTEL CORP·Filed 2016·Granted Jun 15, 2021·2 cites·25 claims
- 3474US10594294B2Piezoelectric package-integrated delay linesINTEL CORP·Filed 2016·Granted Mar 17, 2020·2 cites·22 claims
- 3574US10475750B2Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integrationINTEL CORP·Filed 2016·Granted Nov 12, 2019·2 cites·28 claims
- 3665US6057566ASemiconductor deviceMOTOROLA INC·Filed 1998·Granted May 2, 2000·24 cites·19 claims
- 3765US2022246554A1Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabricINTEL CORP·Filed 2022·Application pending·0 cites
- 3864US5739557ARefractory gate heterostructure field effect transistorMOTOROLA INC·Filed 1995·Granted Apr 14, 1998·26 cites·16 claims
- 3964US2020412858A1Microelectronic devices designed with integrated antennas on a substrateINTEL CORP·Filed 2020·Application pending·0 cites
- 4063US6509875B1Electronically tuned active antenna apparatusMOTOROLA INC·Filed 2001·Granted Jan 21, 2003·18 cites·27 claims
- 4163US2020236205A1Microelectronic devices designed with integrated antenna on a substrateINTEL CORP·Filed 2020·Application pending·0 cites
- 4261US5119149AGate-drain shield reduces gate to drain capacitanceMOTOROLA INC·Filed 1990·Granted Jun 2, 1992·20 cites·11 claims
- 4360US11367708B2Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabricINTEL CORP·Filed 2019·Granted Jun 21, 2022·0 cites·15 claims
- 4459US10032052B2Piezoelectric package-integrated delay lines for radio frequency identification tagsINTEL CORP·Filed 2017·Granted Jul 24, 2018·0 cites·26 claims
- 4556US6623945B1System and method for microwave cell lysing of small samplesMOTOROLA INC·Filed 1999·Granted Sep 23, 2003·15 cites·9 claims
- 4654US5325000AFrequency mixing circuit with impedance transforming power combinerMOTOROLA INC·Filed 1993·Granted Jun 28, 1994·17 cites·15 claims
- 4752US6594478B1Self oscillating mixerMOTOROLA INC·Filed 2000·Granted Jul 15, 2003·3 cites·18 claims
- 4849US10432167B2Piezoelectric package-integrated crystal devicesINTEL CORP·Filed 2016·Granted Oct 1, 2019·0 cites·20 claims
- 4948US5124674ALumped element directional filterMOTOROLA INC·Filed 1991·Granted Jun 23, 1992·9 cites·8 claims
- 5045US11283427B2Hybrid filters and packages thereforINTEL CORP·Filed 2017·Granted Mar 22, 2022·0 cites·24 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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