Inventor
SOTO JAVIER
US7 patents
⚠️ This page may combine multiple inventors who share the name “SOTO JAVIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS10651525B2May 12, 2020
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
INTEL CORP5 citations83
US9992859B2Jun 5, 2018
Low loss and low cross talk transmission lines using shaped vias
INTEL CORP5 citations83
US11791528B2Oct 17, 2023
Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line
INTEL CORP0 citations62
US11329358B2May 10, 2022
Low loss and low cross talk transmission lines having l-shaped cross sections
INTEL CORP0 citations62
US10381291B2Aug 13, 2019
Lithographacally defined vias for organic package substrate scaling
INTEL CORP0 citations51