Inventor
KIM JEA WON
KR3 patents
Patents
3 patentsUS11876012B2Jan 16, 2024
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD0 citations57
US11139220B2Oct 5, 2021
Flexible semiconductor package formed by roll-to-roll process
HAESUNG DS CO LTD0 citations52
US10811302B2Oct 20, 2020
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
HAESUNG DS CO LTD0 citations41