Inventor
LIU HSIU-CHI
TW5 patents
Patents
5 patentsUS11342282B2May 24, 2022
Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US12374631B2Jul 29, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US11798858B2Oct 24, 2023
Semiconductor package structure including reinforcement component and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US10943843B2Mar 9, 2021
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG0 citations59
US11094649B2Aug 17, 2021
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations55