Inventor
KIM PYOUNGWAN
KR9 patents
Patents
9 patentsUS8026592B2Sep 27, 2011
Through-silicon via structures including conductive protective layers
SAMSUNG ELECTRONICS CO LTD45 citations90
US10622340B2Apr 14, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations81
US11309228B2Apr 19, 2022
Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US10361177B2Jul 23, 2019
Semiconductor package having a molding layer including a molding cavity and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US11133296B2Sep 28, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations70
US11557574B2Jan 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11075189B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11482507B2Oct 25, 2022
Semiconductor package having molding member and heat dissipation member
SAMSUNG ELECTRONICS CO LTD0 citations50
US11257786B2Feb 22, 2022
Semiconductor package including molding member, heat dissipation member, and reinforcing member
SAMSUNG ELECTRONICS CO LTD0 citations50