Inventor

BEYNE ERIC

BE70 patents

⚠️ This page may combine multiple inventors who share the name “BEYNE ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BEYNE ERIC

IMEC VZW

Integrated circuit chip with power delivery network on the backside of the chip

Semiconductor die package and method of producing the package

Image sensor ball grid array package and the fabrication thereof

Imager or particle or radiation detector and method of manufacturing the same

Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device

Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device

Position sensitive particle sensor and manufacturing method therefor

Microwave oscillator, an antenna therefor and methods of manufacture

Method for bonding and interconnecting integrated circuit devices

Method for aligning micro-electronic components

Method for self-aligned solder reflow bonding and devices obtained thereof

Liquid cooling of electronic devices

Method for transferring and stacking of semiconductor devices

Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC

Method of bonding semiconductor substrates

Method for packaging semiconductor dies

Substrate, assembly and method for wafer-to-wafer hybrid bonding

Method for bonding and interconnecting integrated circuit devices

Method for dicing a semiconductor substrate into a plurality of dies

IMEC INTER UNI MICRO ELECTR

Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

Method for producing electrical through hole interconnects and devices made thereof

Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

Method for chip singulation

Methods of bonding two semiconductor devices

Methods for bonding and micro-electronic devices produced according to such methods

Wide frequency band planar antenna

Method and apparatus for thermal impedance evaluation of packaged semiconductor components

Methods of bonding two semiconductor devices

Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base

IMEC

Methods for bonding and micro-electronic devices produced according to such methods

System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

Device having a bonding structure for two elements

Method for bonding a die or substrate to a carrier

Semiconductor device having through-substrate vias

Plurality of devices attached by solder bumps

Method for producing contact areas on a semiconductor substrate

SIEMENS NV

Polymer stud grid array for microwave circuit arrangements

Polymer stud grid array

Polymer stud grid array

Polymer stud grid array

BEYNE ERIC

Window interposed die packaging

Method for forming isolation trenches

Method for insertion bonding and device thus obtained

TEZCAN DENIZ SABUNCUOGLU

Method for forming 3D-interconnect structures with airgaps

Method for fabricating through substrate vias

INTERUNIVERSITAIR MICRO ELKTRO

Method of fabrication of a microstructure having an internal cavity

YEDA RES & DEV

Imager or particle detector and method of manufacturing the same

(unassigned)

Method for thermal impedance evaluation of packaged semiconductor components

ZHANG WENQI

Methods and systems for material bonding

OPRINS HERMAN

Device for cooling integrated circuits