Inventor
HOU XINYU
CN13 patents
⚠️ This page may combine multiple inventors who share the name “HOU XINYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HUAWEI TECH CO LTD
12 patentsUS9940032B2Apr 10, 2018
Storage system, method, and apparatus for processing multi-layer protocol encapsulation or decapsulation operation requests
HUAWEI TECH CO LTD2 citations72
US9753650B2Sep 5, 2017
Storage system, method, and apparatus for processing multi-layer protocol encapsulation or decapsulation operation requests
HUAWEI TECH CO LTD3 citations72
US9336179B2May 10, 2016
Computer subsystem and computer system with composite nodes in an interconnection structure
HUAWEI TECH CO LTD3 citations70
US10061519B2Aug 28, 2018
Storage system, method, and apparatus for processing multi-layer protocol encapsulation or decapsulation operation requests
HUAWEI TECH CO LTD1 citations62
US9148264B2Sep 29, 2015
Data transmission method, device and system
HUAWEI TECH CO LTD2 citations61
US8909979B2Dec 9, 2014
Method and system for implementing interconnection fault tolerance between CPU
HUAWEI TECH CO LTD2 citations61
US8990460B2Mar 24, 2015
CPU interconnect device
HUAWEI TECH CO LTD2 citations60
US10372343B2Aug 6, 2019
Storage system, method, and apparatus for processing operation request
HUAWEI TECH CO LTD0 citations51
US10409766B2Sep 10, 2019
Computer subsystem and computer system with composite nodes in an interconnection structure
HUAWEI TECH CO LTD0 citations49
US9880972B2Jan 30, 2018
Computer subsystem and computer system with composite nodes in an interconnection structure
HUAWEI TECH CO LTD0 citations49
US11620227B2Apr 4, 2023
Data processing method, network interface card, and server
HUAWEI TECH CO LTD0 citations48
US12259843B2Mar 25, 2025
Transmission device and communication system for artificial intelligence chips
HUAWEI TECH CO LTD0 citations47