Inventor
FUTATSUMORI KOJI
JP27 patents
⚠️ This page may combine multiple inventors who share the name “FUTATSUMORI KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
25 patentsUS5198479AMar 30, 1993
Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO86 citations96
US4323488AApr 6, 1982
Method for the preparation of silicone-modified polyoxyalkylene polyethers and room temperature-curable compositions therewith
SHINETSU CHEMICAL CO70 citations96
US4302571ANov 24, 1981
Room temperature-curable polyoxyalkylene polyether compositions
SHINETSU CHEMICAL CO74 citations96
US4877822AOct 31, 1989
Epoxy resin composition
SHINETSU CHEMICAL CO42 citations93
US4761454AAug 2, 1988
Method for the preparation of fine spherical particles of silicone elastomer
SHINETSU CHEMICAL CO96 citations93
US4701482AOct 20, 1987
Epoxy resin composition for encapsulation of semiconductor devices
SHINETSU CHEMICAL CO28 citations93
US4618646AOct 21, 1986
Room temperature-curable organopolysiloxane composition
SHINETSU CHEMICAL CO42 citations93
US4339563AJul 13, 1982
Novel organopolysiloxanes and room temperature curable organopolysiloxane compositions containing the same
SHINETSU CHEMICAL CO51 citations93
US5336786AAug 9, 1994
Organic silicon compounds
SHINETSU CHEMICAL CO24 citations92
US5175199ADec 29, 1992
High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions
SHINETSU CHEMICAL CO47 citations92
US5248710ASep 28, 1993
Flip chip encapsulating compositions and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO43 citations90
US5137940AAug 11, 1992
Semiconductor encapsulating epoxy resin compositions
SHINETSU CHEMICAL CO49 citations90
US5166228ANov 24, 1992
Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO18 citations74
US5053445AOct 1, 1991
Epoxy resin composition
SHINETSU CHEMICAL CO12 citations74
US5006614AApr 9, 1991
Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer
SHINETSU CHEMICAL CO12 citations74
US4304920ADec 8, 1981
Novel organosilane compounds
SHINETSU CHEMICAL CO9 citations74
US4294975AOct 13, 1981
Hydroalkenyloxysilanes
SHINETSU CHEMICAL CO14 citations74
US5235005AAug 10, 1993
Polyimide resin composition and semiconductor device encapsulated therewith
SHINETSU CHEMICAL CO16 citations71
US5473091ADec 5, 1995
Quaternary phosphorus compounds and their preparation
SHINETSU CHEMICAL CO4 citations63
US4579963AApr 1, 1986
Organosilicon compound and a room temperature curable organopolysiloxane composition formulated therewith
SHINETSU CHEMICAL CO5 citations63
US4288375ASep 8, 1981
Novel organosilane compounds
SHINETSU CHEMICAL CO2 citations63
US7534840B2May 19, 2009
Room temperature-curable organopolysiloxane compositions
SHINETSU CHEMICAL CO5 citations61
US5362887ANov 8, 1994
Fluorine - modified acid anhydrides
SHINETSU CHEMICAL CO1 citations52
US4891434AJan 2, 1990
Novel organosilicon compound
SHINETSU CHEMICAL CO0 citations52
US4577041AMar 18, 1986
Cyclic organopolysiloxane compound
SHINETSU CHEMICAL CO1 citations52