Inventor
WHANG TSUNG CHUAN
US4 patents
⚠️ This page may combine multiple inventors who share the name “WHANG TSUNG CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WHANG TSUNG CHUAN
2 patentsUS9349610B2May 24, 2016
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
WHANG TSUNG CHUAN5 citations79
US9111846B1Aug 18, 2015
Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
WHANG TSUNG CHUAN6 citations79