Inventor · disambiguated record
Tomio Otsuki
Also filed as: OTSUKI TOMIO
13 granted patents·3 pending applications·21 citations·filing 2010–2023
86Inventor score
Files withJX NIPPON MINING & METALS CORP8NAGATA KENICHI3TSUKAMOTO SHIRO3JX ADVANCED METALS CORP1OTSUKI TOMIO1
Top patents by PatentIndex Score
16 records- 0191US8663440B2Titanium target for sputteringTSUKAMOTO SHIRO·Filed 2010·Granted Mar 4, 2014·6 cites·9 claims
- 0289US9090970B2High-purity copper-manganese-alloy sputtering targetNAGATA KENICHI·Filed 2012·Granted Jul 28, 2015·5 cites·7 claims
- 0386US12241153B2Sputtering target and manufacturing method thereforJX ADVANCED METALS CORP·Filed 2023·Granted Mar 4, 2025·0 cites·10 claims
- 0480US9165750B2High purity copper—manganese alloy sputtering targetJX NIPPON MINING & METALS CORP·Filed 2013·Granted Oct 20, 2015·5 cites·11 claims
- 0578US10276356B2Copper alloy sputtering targetJX NIPPON MINING & METALS CORP·Filed 2014·Granted Apr 30, 2019·1 cites·7 claims
- 0675US9704695B2Sputtering target and manufacturing method thereforNAGATA KENICHI·Filed 2012·Granted Jul 11, 2017·3 cites·4 claims
- 0772US11718907B2Sputtering target and manufacturing method thereforJX NIPPON MINING & METALS CORP·Filed 2018·Granted Aug 8, 2023·0 cites·8 claims
- 0865US9773651B2High-purity copper sputtering targetJX NIPPON MINING & METALS CORP·Filed 2012·Granted Sep 26, 2017·1 cites·9 claims
- 0962US9909196B2High-purity copper-cobalt alloy sputtering targetJX NIPPON MINING & METALS CORP·Filed 2014·Granted Mar 6, 2018·0 cites·12 claims
- 1056US10297429B2High-purity copper-chromium alloy sputtering targetJX NIPPON MINING & METALS CORP·Filed 2013·Granted May 21, 2019·0 cites·7 claims
- 1154US9347130B2Lanthanum target for sputteringTSUKAMOTO SHIRO·Filed 2010·Granted May 24, 2016·0 cites·4 claims
- 1250US2014158532A1High-purity copper-manganese-alloy sputtering targetNAGATA KENICHI·Filed 2012·Application pending·0 cites
- 1347US9382612B2Lanthanum target for sputteringTSUKAMOTO SHIRO·Filed 2010·Granted Jul 5, 2016·0 cites·9 claims
- 1442US10494712B2Copper alloy sputtering target and method for manufacturing sameJX NIPPON MINING & METALS CORP·Filed 2016·Granted Dec 3, 2019·0 cites·8 claims
- 1539US2014110849A1Copper-Titanium Alloy Sputtering Target, Semiconductor Wiring Line Formed Using the Sputtering Target, and Semiconductor Element and Device Each Equipped with the Semiconductor Wiring LineOTSUKI TOMIO·Filed 2012·Application pending·0 cites
- 1637US2019085442A1Copper or copper alloy target containing argon or hydrogenJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →