Inventor · disambiguated record
Eiji Hayashishita
Also filed as: HAYASHISHITA EIJI
19 granted patents·2 pending applications·10 citations·filing 2011–2022
88Inventor score
Top patents by PatentIndex Score
21 records- 0183US11535776B2Film for manufacturing semiconductor partsMITSUI CHEMICALS TOHCELLO INC·Filed 2020·Granted Dec 27, 2022·1 cites·12 claims
- 0274US8728910B2Expandable film, dicing film, and method of producing semiconductor deviceHAYASHISHITA EIJI·Filed 2011·Granted May 20, 2014·5 cites·12 claims
- 0369US10573548B2Method for manufacturing semiconductor deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Feb 25, 2020·1 cites·10 claims
- 0469US10566254B2Method for manufacturing semiconductor deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Feb 18, 2020·1 cites·10 claims
- 0568US10858547B2Film for manufacturing semiconductor partsMITSUI CHEMICALS TOHCELLO INC·Filed 2016·Granted Dec 8, 2020·1 cites·10 claims
- 0665US11942349B2Film for component manufacture and component manufacturing methodMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Granted Mar 26, 2024·0 cites·8 claims
- 0762US11747388B2Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatusMITSUI CHEMICALS TOHCELLO INC·Filed 2021·Granted Sep 5, 2023·0 cites·3 claims
- 0862US10483131B2Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing packageMITSUI CHEMICALS TOHCELLO INC·Filed 2016·Granted Nov 19, 2019·1 cites·14 claims
- 0951US11047900B2Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatusMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Jun 29, 2021·0 cites·11 claims
- 1051US2024312848A1Electronic component manufacturing method, manufacturing film, and manufacturing toolMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 1150US11276600B2Film for component manufacture and component manufacturing methodMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Mar 15, 2022·0 cites·10 claims
- 1248US2023298924A1Protective film and back grinding method for semiconductor waferMITSUI CHEMICALS TOHCELLO INC·Filed 2021·Application pending·0 cites
- 1346US11107789B2Method for manufacturing semiconductor deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Aug 31, 2021·0 cites·16 claims
- 1445US12165904B2Component manufacturing device and component manufacturing methodMITSUI CHEMICALS TOHCELLO INC·Filed 2018·Granted Dec 10, 2024·0 cites·13 claims
- 1543US12068188B2Component producing method, holding film, and holding tool forming deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2019·Granted Aug 20, 2024·0 cites·8 claims
- 1643US9475962B2Production method for laminate film, laminate film, and production method for semiconductor device employing sameMITSUI CHEMICALS TOHCELLO INC·Filed 2014·Granted Oct 25, 2016·0 cites·24 claims
- 1741US11984341B2Component-manufacturing tool and component-manufacturing methodMITSUI CHEMICALS TOHCELLO INC·Filed 2018·Granted May 14, 2024·0 cites·4 claims
- 1841US11453208B2Adhesive laminate film and method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Sep 27, 2022·0 cites·18 claims
- 1941US11251062B2Component-manufacturing film, component-manufacturing tool, and component-manufacturing methodMITSUI CHEMICALS TOHCELLO INC·Filed 2018·Granted Feb 15, 2022·0 cites·8 claims
- 2039US10809293B2Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatusMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Oct 20, 2020·0 cites·18 claims
- 2138US8476740B2Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheetHAYASHISHITA EIJI·Filed 2011·Granted Jul 2, 2013·0 cites·15 claims
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