Inventor
WHITTEN KYLE
US13 patents
Patents
13 patentsUS11035048B2Jun 15, 2021
Cobalt filling of interconnects
MACDERMID ENTHONE INC3 citations70
US10519557B2Dec 31, 2019
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC2 citations70
US11697884B2Jul 11, 2023
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
US11124888B2Sep 21, 2021
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
US12398480B2Aug 26, 2025
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC0 citations60
US11401618B2Aug 2, 2022
Cobalt filling of interconnects
MACDERMID ENTHONE INC0 citations59
US11168406B2Nov 9, 2021
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC0 citations59
US11434578B2Sep 6, 2022
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US10995417B2May 4, 2021
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US11807951B2Nov 7, 2023
Cobalt chemistry for smooth topology
MACDERMID ENTHONE INC0 citations55
US11230778B2Jan 25, 2022
Cobalt chemistry for smooth topology
MACDERMID ENTHONE INC0 citations55
US12270121B2Apr 8, 2025
Composition and method for fabrication of nickel interconnects
MACDERMID ENTHONE INC0 citations49
US10294574B2May 21, 2019
Levelers for copper deposition in microelectronics
MACDERMID ENTHONE INC0 citations38