Inventor
COMMANDER JOHN
US9 patents
⚠️ This page may combine multiple inventors who share the name “COMMANDER JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACDERMID ENTHONE INC
6 patentsUS11035048B2Jun 15, 2021
Cobalt filling of interconnects
MACDERMID ENTHONE INC3 citations70
US11697884B2Jul 11, 2023
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
US11124888B2Sep 21, 2021
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
US11401618B2Aug 2, 2022
Cobalt filling of interconnects
MACDERMID ENTHONE INC0 citations59
US11434578B2Sep 6, 2022
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US10995417B2May 4, 2021
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58