Inventor
BAE BYUNGMOON
KR6 patents
Patents
6 patentsUS10032706B2Jul 24, 2018
Package substrates
SAMSUNG ELECTRONICS CO LTD2 citations70
US11676914B2Jun 13, 2023
Semiconductor substrate and method of sawing the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US11854892B2Dec 26, 2023
Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them
SAMSUNG ELECTRONICS CO LTD0 citations58
US11322405B2May 3, 2022
Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them
SAMSUNG ELECTRONICS CO LTD0 citations58
US12062626B2Aug 13, 2024
Semiconductor substrate and method of sawing the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US10256181B2Apr 9, 2019
Package substrates
SAMSUNG ELECTRONICS CO LTD0 citations49