Inventor
OKANIWA MASASHI
JP5 patents
Patents
5 patentsUS12195566B2Jan 14, 2025
Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations56
US11935803B2Mar 19, 2024
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations56
US12534559B2Jan 27, 2026
Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations49
US11924979B2Mar 5, 2024
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations46
US12568848B2Mar 3, 2026
Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations45