Inventor

IWAKURA TETSURO

JP3 patents

⚠️ This page may combine multiple inventors who share the name “IWAKURA TETSURO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

1 patent

US8017444B2Sep 13, 2011

Adhesive sheet, semiconductor device, and process for producing semiconductor device

HITACHI CHEMICAL CO LTD8 citations81

SHOWA DENKO MATERIALS CO LTD

1 patent

US11905412B2Feb 20, 2024

Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package

SHOWA DENKO MATERIALS CO LTD0 citations53

RESONAC CORP

1 patent

US12466946B2Nov 11, 2025

Method for producing FRP precursor

RESONAC CORP0 citations46