Inventor

RENSCH DAVID B

US12 patents

⚠️ This page may combine multiple inventors who share the name “RENSCH DAVID B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUGHES AIRCRAFT CO

8 patents

US5629241AMay 13, 1997

Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same

HUGHES AIRCRAFT CO121 citations97

US5528209AJun 18, 1996

Monolithic microwave integrated circuit and method

HUGHES AIRCRAFT CO134 citations97

US5272133ADec 21, 1993

Passivation of thin film oxide superconductors

HUGHES AIRCRAFT CO7 citations73

US4569124AFeb 11, 1986

Method for forming thin conducting lines by ion implantation and preferential etching

HUGHES AIRCRAFT CO19 citations73

US5532486AJul 2, 1996

Heterojunction diode with low turn-on voltage

HUGHES AIRCRAFT CO15 citations72

US5404028AApr 4, 1995

Electrical junction device with lightly doped buffer region to precisely locate a p-n junction

HUGHES AIRCRAFT CO17 citations72

US5572049ANov 5, 1996

Multi-layer collector heterojunction transistor

HUGHES AIRCRAFT CO8 citations71

US5114910AMay 19, 1992

Passivation of thin film oxide superconductors

HUGHES AIRCRAFT CO4 citations62

HUGHES ELECTRONICS CORP

4 patents

US5757074AMay 26, 1998

Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements

HUGHES ELECTRONICS CORP301 citations98

US6028483AFeb 22, 2000

Universal fixture/package for spatial-power-combined amplifier

HUGHES ELECTRONICS CORP52 citations94

US6274922B1Aug 14, 2001

Fabrication of high power semiconductor device with a heat sink and integration with planar microstrip circuitry

HUGHES ELECTRONICS CORP7 citations72

US6048777AApr 11, 2000

Fabrication of high power semiconductor devices with respective heat sinks for integration with planar microstrip circuitry

HUGHES ELECTRONICS CORP10 citations72