Inventor

KLEFFNER JAMES H

US4 patents

⚠️ This page may combine multiple inventors who share the name “KLEFFNER JAMES H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

2 patents

US6077726AJun 20, 2000

Method and apparatus for stress relief in solder bump formation on a semiconductor device

MOTOROLA INC225 citations96

US5943597AAug 24, 1999

Bumped semiconductor device having a trench for stress relief

MOTOROLA INC261 citations95

FREESCALE SEMICONDUCTOR INC

2 patents

US6815254B2Nov 9, 2004

Semiconductor package with multiple sides having package contacts

FREESCALE SEMICONDUCTOR INC164 citations92

US7479407B2Jan 20, 2009

Digital and RF system and method therefor

FREESCALE SEMICONDUCTOR INC26 citations86