Inventor

MISTRY ADDI BURJORJI

US2 patents

Patents

2 patents

US6077726AJun 20, 2000

Method and apparatus for stress relief in solder bump formation on a semiconductor device

MOTOROLA INC225 citations96

US5943597AAug 24, 1999

Bumped semiconductor device having a trench for stress relief

MOTOROLA INC261 citations95