Inventor
WU SHYH-ING
TW9 patents
Patents
9 patentsUS6692581B2Feb 17, 2004
Solder paste for fabricating bump
ADVANCED SEMICONDUCTOR ENG18 citations92
US6918178B2Jul 19, 2005
Method of attaching a heat sink to an IC package
ADVANCED SEMICONDUCTOR ENG26 citations88
US7651937B2Jan 26, 2010
Bumping process and structure thereof
ADVANCED SEMICONDUCTOR ENG9 citations81
US5982625ANov 9, 1999
Semiconductor packaging device
ADVANCED SEMICONDUCTOR ENG15 citations71
US7518241B2Apr 14, 2009
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
ADVANCED SEMICONDUCTOR ENG7 citations69
US6355499B1Mar 12, 2002
Method of making ball grid array package
ADVANCED SEMICONDUCTOR ENG8 citations68
US6429049B1Aug 6, 2002
Laser method for forming vias
ADVANCED SEMICONDUCTOR ENG3 citations57
US6252309B1Jun 26, 2001
Packaged semiconductor substrate
ADVANCED SEMICONDUCTOR ENG0 citations50
US7727878B2Jun 1, 2010
Method for forming passivation layer
ADVANCED SEMICONDUCTOR ENG0 citations39