Inventor
WENSEL RICHARD
US6 patents
Patents
6 patentsUS6387731B1May 14, 2002
Method and apparatus for reducing BGA warpage caused by encapsulation
MICRON TECHNOLOGY INC15 citations90
US6291899B1Sep 18, 2001
Method and apparatus for reducing BGA warpage caused by encapsulation
MICRON TECHNOLOGY INC26 citations90
US6444497B2Sep 3, 2002
Method and apparatus for reducing BGA warpage caused by encapsulation
MICRON TECHNOLOGY INC8 citations71
US7384805B2Jun 10, 2008
Transfer mold semiconductor packaging processes
MICRON TECHNOLOGY INC5 citations70
US7148083B2Dec 12, 2006
Transfer mold semiconductor packaging processes
MICRON TECHNOLOGY INC5 citations70
US7095115B2Aug 22, 2006
Circuit substrates, semiconductor packages, and ball grid arrays
MICRON TECHNOLOGY INC0 citations48