Inventor
WU SHENG-TSAI
TW17 patents
⚠️ This page may combine multiple inventors who share the name “WU SHENG-TSAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
14 patentsUSD976852SJan 31, 2023
Power module
IND TECH RES INST8 citations83
US9252054B2Feb 2, 2016
Thinned integrated circuit device and manufacturing process for the same
IND TECH RES INST7 citations83
US11004816B2May 11, 2021
Hetero-integrated structure
IND TECH RES INST3 citations72
US11424190B2Aug 23, 2022
Multi-chip package and manufacture method thereof
IND TECH RES INST2 citations71
US11251174B2Feb 15, 2022
Image sensor package and manufacturing method thereof
IND TECH RES INST2 citations71
US11854961B2Dec 26, 2023
Package substrate and method of fabricating the same and chip package structure
IND TECH RES INST1 citations62
US12074137B2Aug 27, 2024
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11646270B2May 9, 2023
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11587905B2Feb 21, 2023
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11569217B2Jan 31, 2023
Image sensor package and manufacturing method thereof
IND TECH RES INST0 citations60
US9448121B2Sep 20, 2016
Measurement method, measurement apparatus, and computer program product
IND TECH RES INST2 citations60
US12381133B2Aug 5, 2025
Power semiconductor device
IND TECH RES INST0 citations58
US12009341B2Jun 11, 2024
Integrated antenna package structure
IND TECH RES INST0 citations48
US10540474B2Jan 21, 2020
Chip temperature computation method and chip temperature computation device
IND TECH RES INST0 citations41