Inventor
SALMON JAY SCOTT
US10 patents
⚠️ This page may combine multiple inventors who share the name “SALMON JAY SCOTT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOSCH GMBH ROBERT
6 patentsUS10057688B2Aug 21, 2018
Lead frame-based chip carrier used in the fabrication of MEMS transducer packages
BOSCH GMBH ROBERT2 citations70
US9661421B2May 23, 2017
Microphone package with molded spacer
BOSCH GMBH ROBERT2 citations70
US10028068B2Jul 17, 2018
Metalized microphone lid with integrated wire bonding shelf
BOSCH GMBH ROBERT0 citations49
US9894444B2Feb 13, 2018
Microphone package with molded spacer
BOSCH GMBH ROBERT0 citations49
US9641940B2May 2, 2017
Metalized microphone lid with integrated wire bonding shelf
BOSCH GMBH ROBERT1 citations49
US10160637B2Dec 25, 2018
Molded lead frame package with embedded die
BOSCH GMBH ROBERT0 citations39
QUALCOMM INC
4 patentsUS12100669B2Sep 24, 2024
Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods
QUALCOMM INC0 citations56
US11985804B2May 14, 2024
Package comprising a block device with a shield and method of fabricating the same
QUALCOMM INC1 citations56
US11721639B2Aug 8, 2023
Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
QUALCOMM INC1 citations56
US12100649B2Sep 24, 2024
Package comprising an integrated device with a back side metal layer
QUALCOMM INC0 citations50