Inventor
TOLENTINO ERIK NINO MERCADO
MY4 patents
Patents
4 patentsUS11626677B2Apr 11, 2023
Bonding module pins to an electronic substrate
SEMICONDUCTOR COMPONENTS IND LLC2 citations64
US12170239B2Dec 17, 2024
Direct bonded copper substrates fabricated using silver sintering
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11776870B2Oct 3, 2023
Direct bonded copper substrates fabricated using silver sintering
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US12160060B2Dec 3, 2024
Bonding module pins to an electronic substrate
SEMICONDUCTOR COMPONENTS IND LLC0 citations54