Inventor
KRISHNAN SHUTESH
MY20 patents
⚠️ This page may combine multiple inventors who share the name “KRISHNAN SHUTESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
13 patentsUS10319639B2Jun 11, 2019
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations89
US11830856B2Nov 28, 2023
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations83
US11721654B2Aug 8, 2023
Ultra-thin multichip power devices
SEMICONDUCTOR COMPONENTS IND LLC2 citations69
US10930604B2Feb 23, 2021
Ultra-thin multichip power devices
SEMICONDUCTOR COMPONENTS IND LLC2 citations69
US11626677B2Apr 11, 2023
Bonding module pins to an electronic substrate
SEMICONDUCTOR COMPONENTS IND LLC2 citations64
US12347813B2Jul 1, 2025
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12170239B2Dec 17, 2024
Direct bonded copper substrates fabricated using silver sintering
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11776870B2Oct 3, 2023
Direct bonded copper substrates fabricated using silver sintering
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11942369B2Mar 26, 2024
Thin semiconductor package for notched semiconductor die
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US12160060B2Dec 3, 2024
Bonding module pins to an electronic substrate
SEMICONDUCTOR COMPONENTS IND LLC0 citations54
US10763173B2Sep 1, 2020
Thin semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations45
US9997485B2Jun 12, 2018
Bonding structure and method
SEMICONDUCTOR COMPONENTS IND LLC1 citations44
US9780059B2Oct 3, 2017
Bonding structure and method
SEMICONDUCTOR COMPONENTS IND LLC0 citations44
KRISHNAN SHUTESH
4 patentsUS8451621B2May 28, 2013
Semiconductor component and method of manufacture
KRISHNAN SHUTESH6 citations82
US8268676B2Sep 18, 2012
Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads
KRISHNAN SHUTESH6 citations82
US8519521B2Aug 27, 2013
Electronic device including a packaging substrate having a trench
KRISHNAN SHUTESH2 citations61
US8449339B2May 28, 2013
Connector assembly and method of manufacture
KRISHNAN SHUTESH4 citations61