Inventor
MA KEUMHEE
KR6 patents
Patents
6 patentsUS8026592B2Sep 27, 2011
Through-silicon via structures including conductive protective layers
SAMSUNG ELECTRONICS CO LTD45 citations90
US11626370B2Apr 11, 2023
Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure
SAMSUNG ELECTRONICS CO LTD2 citations68
US12315818B2May 27, 2025
Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure
SAMSUNG ELECTRONICS CO LTD0 citations58
US11688667B2Jun 27, 2023
Semiconductor package including a pad pattern
SAMSUNG ELECTRONICS CO LTD1 citations58
US11145573B2Oct 12, 2021
Semiconductor package including a pad pattern
SAMSUNG ELECTRONICS CO LTD0 citations58
US12543603B2Feb 3, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47