Inventor
KIM JUNGIHL
US13 patents
Patents
13 patentsUS5582858ADec 10, 1996
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM113 citations98
US5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US4975079ADec 4, 1990
Connector assembly for chip testing
IBM240 citations98
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US5326643AJul 5, 1994
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM41 citations96
US5283104AFeb 1, 1994
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
IBM80 citations94
US5599582AFeb 4, 1997
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM25 citations92
US4781970ANov 1, 1988
Strengthening a ceramic by post sinter coating with a compressive surface layer
IBM28 citations92
US5337475AAug 16, 1994
Process for producing ceramic circuit structures having conductive vias
IBM37 citations91
US4896464AJan 30, 1990
Formation of metallic interconnects by grit blasting
IBM12 citations73
US4751349AJun 14, 1988
Zirconium as an adhesion material in a multi-layer metallic structure
IBM8 citations72
US5170245ADec 8, 1992
Semiconductor device having metallic interconnects formed by grit blasting
IBM5 citations62
US5053272AOct 1, 1991
Optical storage device
IBM3 citations62