Inventor

HAGIWARA SHINSUKE

JP21 patents

⚠️ This page may combine multiple inventors who share the name “HAGIWARA SHINSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAGIWARA SHINSUKE

HITACHI CHEMICAL CO LTD

Fabrication process of semiconductor package and semiconductor package

Method of producing boards for printed wiring

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin

Phenyl, naphthly or fluorene cyclopentyl epoxy resins

Epoxy resin molding material for sealing of electronic component

Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate

Epoxy resin molding material for sealing use and semiconductor device

Phenyl, naphthyl or fluorene cyclopentyl epoxy resins

Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer

Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone

Method of preparing naphthol-modified phenolic resin

Phenolic resin, resin composition, molding material for encapsulation, and electronic component device

Method of producing a naphthol-modified phenolic resin of highly increased molecular weight

Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts

Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler

Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same

(unassigned)

Fabrication process of semiconductor package and semiconductor package

NHK SPRING CO LTD

Vehicle seat assembly

TAKAHASHI HISATO

Liquid resin composition for electronic components and electronic component device