Inventor
TOKITA MASAKUNI
JP6 patents
Patents
6 patentsUS5732465AMar 31, 1998
Method of manufacturing one side resin sealing type semiconductor devices
SHINKO ELECTRIC IND CO41 citations91
US5231756AAug 3, 1993
Process for manufacturing a multi-layer lead frame
SHINKO ELECTRIC IND CO27 citations91
US5918746AJul 6, 1999
Carrier frame used for circuit boards
SHINKO ELECTRIC IND CO11 citations72
US6271483B1Aug 7, 2001
Wiring board having vias
SHINKO ELECTRIC IND CO13 citations69
US6966742B2Nov 22, 2005
Work arrangement apparatus
SHINKO ELECTRIC IND CO6 citations61
USRE35353EOct 22, 1996
Process for manufacturing a multi-layer lead frame
SHINKO ELECTRIC IND CO5 citations61