Inventor
SEBESTA ROBERT D
US10 patents
Patents
10 patentsUS6373717B1Apr 16, 2002
Electronic package with high density interconnect layer
IBM97 citations97
US6351393B1Feb 26, 2002
Electronic package for electronic components and method of making same
IBM71 citations96
US6291779B1Sep 18, 2001
Fine pitch circuitization with filled plated through holes
IBM52 citations94
US6829823B2Dec 14, 2004
Method of making a multi-layered interconnect structure
IBM31 citations92
US6618940B2Sep 16, 2003
Fine pitch circuitization with filled plated through holes
IBM19 citations91
US6538213B1Mar 25, 2003
High density design for organic chip carriers
IBM40 citations90
US5505320AApr 9, 1996
Method employing laser ablating for providing a pattern on a substrate
IBM29 citations89
US5612573AMar 18, 1997
Electronic package with multilevel connections
IBM33 citations88
US7024764B2Apr 11, 2006
Method of making an electronic package
IBM8 citations73
US6014809AJan 18, 2000
Method for circuitizing over an edge of a circuit card
IBM10 citations73