Inventor
HANNA CARLTON
US9 patents
Patents
9 patentsUS6989586B2Jan 24, 2006
Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems
INTEL CORP27 citations90
US7517787B2Apr 14, 2009
C4 joint reliability
INTEL CORP8 citations81
US12211796B2Jan 28, 2025
Microelectronic assemblies having topside power delivery structures
INTEL CORP0 citations62
US12538797B2Jan 27, 2026
Substrate for improved heat dissipation and method
INTEL CORP0 citations60
US12476176B2Nov 18, 2025
Glass core substrate printed circuit board for warpage reduction
INTEL CORP0 citations57
US12374625B2Jul 29, 2025
Microelectronic assemblies having topside power delivery structures
INTEL CORP0 citations51
US12243828B2Mar 4, 2025
Microelectronic assemblies having topside power delivery structures
INTEL CORP0 citations51
US7465651B2Dec 16, 2008
Integrated circuit packages with reduced stress on die and associated methods
INTEL CORP1 citations50
US7656035B2Feb 2, 2010
C4 joint reliability
INTEL CORP0 citations49