Inventor
BLACKWELL KIM J
US12 patents
⚠️ This page may combine multiple inventors who share the name “BLACKWELL KIM J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS5372848ADec 13, 1994
Process for creating organic polymeric substrate with copper
IBM74 citations95
US6879492B2Apr 12, 2005
Hyperbga buildup laminate
IBM36 citations92
US6703704B1Mar 9, 2004
Stress reducing stiffener ring
IBM35 citations92
US6518516B2Feb 11, 2003
Multilayered laminate
IBM24 citations92
US6284329B1Sep 4, 2001
Method of forming adherent metal components on a polyimide substrate
IBM20 citations92
US6194076B1Feb 27, 2001
Method of forming adherent metal components on a polyimide substrate
IBM19 citations92
US4508612AApr 2, 1985
Shield for improved magnetron sputter deposition into surface recesses
IBM41 citations91
US5288541AFeb 22, 1994
Method for metallizing through holes in thin film substrates, and resulting devices
IBM26 citations89
US5525369AJun 11, 1996
Method for metallizing through holes in thin film substrates, and resulting devices
IBM16 citations79
US5461203AOct 24, 1995
Electronic package including lower water content polyimide film
IBM10 citations72
US7213336B2May 8, 2007
Hyperbga buildup laminate
IBM3 citations62