Inventor
NISHIHATA HIDEKI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “NISHIHATA HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
16 patentsUS7713842B2May 11, 2010
Method for producing bonded wafer
SUMCO CORP31 citations92
US7625808B2Dec 1, 2009
Method for manufacturing bonded wafer
SUMCO CORP9 citations83
US7851337B2Dec 14, 2010
Method for producing semiconductor substrate
SUMCO CORP5 citations73
US7510948B2Mar 31, 2009
Method for producing SOI wafer
SUMCO CORP7 citations73
US7951692B2May 31, 2011
Method of producing semiconductor substrate having an SOI structure
SUMCO CORP3 citations62
US7858494B2Dec 28, 2010
Laminated substrate manufacturing method and laminated substrate manufactured by the method
SUMCO CORP6 citations62
US7795117B2Sep 14, 2010
Method of producing semiconductor substrate having an SOI structure
SUMCO CORP2 citations62
US7563697B2Jul 21, 2009
Method for producing SOI wafer
SUMCO CORP6 citations62
US7507641B2Mar 24, 2009
Method of producing bonded wafer
SUMCO CORP4 citations62
US7358147B2Apr 15, 2008
Process for producing SOI wafer
SUMCO CORP4 citations62
US7960225B1Jun 14, 2011
Method of controlling film thinning of semiconductor wafer for solid-state image sensing device
SUMCO CORP4 citations61
US7410877B2Aug 12, 2008
Method for manufacturing SIMOX wafer and SIMOX wafer
SUMCO CORP5 citations61
US8003494B2Aug 23, 2011
Method for producing a bonded wafer
SUMCO CORP1 citations51
US7534728B2May 19, 2009
Process for cleaning silicon substrate
SUMCO CORP1 citations51
US7485874B2Feb 3, 2009
Apparatus for manufacturing semiconductor substrates
SUMCO CORP0 citations49
US7927957B2Apr 19, 2011
Method for producing bonded silicon wafer
SUMCO CORP0 citations41