Inventor
KUSABA TATSUMI
JP16 patents
Patents
16 patentsUS7354844B2Apr 8, 2008
Method for manufacturing SOI substrate
SUMCO CORP43 citations95
US7718509B2May 18, 2010
Method for producing bonded wafer
SUMCO CORP26 citations92
US7767549B2Aug 3, 2010
Method of manufacturing bonded wafer
SUMCO CORP8 citations83
US7763541B2Jul 27, 2010
Process for regenerating layer transferred wafer
SUMCO CORP19 citations83
US7442623B2Oct 28, 2008
Method for manufacturing bonded substrate and bonded substrate manufactured by the method
SUMCO CORP17 citations83
US7364984B2Apr 29, 2008
Method for manufacturing SOI substrate
SUMCO CORP12 citations83
US7416960B2Aug 26, 2008
Method for manufacturing SOI substrate
SUMCO CORP7 citations73
US7601227B2Oct 13, 2009
High purification method of jig for semiconductor heat treatment
SUMCO CORP2 citations62
US7541663B2Jun 2, 2009
P-type silicon wafer and method for heat-treating the same
SUMCO CORP4 citations61
US7311775B2Dec 25, 2007
Method for heat-treating silicon wafer and silicon wafer
SUMCO CORP2 citations60
US8003494B2Aug 23, 2011
Method for producing a bonded wafer
SUMCO CORP1 citations51
US7939441B2May 10, 2011
P-type silicon wafer and method for heat-treating the same
SUMCO CORP1 citations51
US7927972B2Apr 19, 2011
Method for producing bonded wafer
SUMCO CORP1 citations51
US7534728B2May 19, 2009
Process for cleaning silicon substrate
SUMCO CORP1 citations51
US7927957B2Apr 19, 2011
Method for producing bonded silicon wafer
SUMCO CORP0 citations41
US7745306B2Jun 29, 2010
Method for producing bonded wafer
SUMCO CORP0 citations40