Inventor

KIM GWANG

KR18 patents

⚠️ This page may combine multiple inventors who share the name “KIM GWANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM GWANG

STATS CHIPPAC LTD

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate

Thin package system with external terminals

Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate

LEE YONGTAEK

Semiconductor device with cross-talk isolation using M-cap and method thereof

Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure

Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package

Semiconductor device with cross-talk isolation using M-cap

Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure

STATS CHIPPAC PTE LTD

Double-sided partial molded SIP module

Double-sided partial molded SiP module

Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

KIM GWANG

Semiconductor package system with substrate heat sink

DESIGNX2 CO LTD

Tea infuser

KIM YOUNGCHEOL

Thin package system with external terminals and method of manufacture thereof