Inventor

KUMAI KOICHI

JP7 patents

⚠️ This page may combine multiple inventors who share the name “KUMAI KOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DSM IP ASSETS BV

4 patents

US10672928B2Jun 2, 2020

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

DSM IP ASSETS BV2 citations71

US9478674B2Oct 25, 2016

Method of manufacturing a circuit board by punching

DSM IP ASSETS BV4 citations70

US10056517B2Aug 21, 2018

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

DSM IP ASSETS BV0 citations50

US10651320B2May 12, 2020

Method of manufacturing a circuit board by punching

DSM IP ASSETS BV0 citations49

TOPPAN PRINTING CO LTD

2 patents

US6438281B1Aug 20, 2002

Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same

TOPPAN PRINTING CO LTD119 citations94

US10986293B2Apr 20, 2021

Solid-state imaging device including microlenses on a substrate and method of manufacturing the same

TOPPAN PRINTING CO LTD0 citations51

YAZAKI CORP

1 patent

US9831567B2Nov 28, 2017

Crimp terminal having a conductor crimping part with an intermediate material with recessed parts and a thin-film layer on its top

YAZAKI CORP4 citations70