P

Inventor

KAGAWA YOSHIHISA

JP40 patents
⚠️ This page may combine multiple inventors who share the name “KAGAWA YOSHIHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONY CORP

22 patents
US9111763B2Aug 18, 2015

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP9 citations92
US10431621B2Oct 1, 2019

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP7 citations84
US10236238B2Mar 19, 2019

Semiconductor device

SONY CORP8 citations84
US10038024B2Jul 31, 2018

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP3 citations84
US9443802B2Sep 13, 2016

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP7 citations84
US9379006B2Jun 28, 2016

Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus

SONY CORP5 citations84
US9190275B2Nov 17, 2015

Bonding substrates with electrical connection through insulating film

SONY CORP5 citations84
US10026769B2Jul 17, 2018

Semiconductor device and solid-state imaging device

SONY CORP12 citations83
US11107855B2Aug 31, 2021

Method for bonding and connecting substrates

SONY CORP1 citations73
US10985102B2Apr 20, 2021

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP2 citations73
US10707258B2Jul 7, 2020

Semiconductor device with multiple substrates electrically connected through an insulating film

SONY CORP1 citations73
US9911778B2Mar 6, 2018

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP2 citations73
US9666627B2May 30, 2017

Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film

SONY CORP2 citations73
US11587857B2Feb 21, 2023

Semiconductor device

SONY CORP0 citations63
US10134795B2Nov 20, 2018

Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method

SONY CORP1 citations63
US11569123B2Jan 31, 2023

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP0 citations62
US10804313B2Oct 13, 2020

Semiconductor device and solid-state imaging device

SONY CORP1 citations62
US7602061B2Oct 13, 2009

Semiconductor device and method for manufacturing semiconductor device

SONY CORP5 citations61
US11004879B2May 11, 2021

Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatus

SONY CORP0 citations60
US9748478B2Aug 29, 2017

Memory device and method of manufacturing the same

SONY CORP0 citations52
US8685786B2Apr 1, 2014

Method of manufacturing a semiconductor memory device having a resistance change memory layer

SONY CORP0 citations51
US10665623B2May 26, 2020

Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatus

SONY CORP0 citations50

SONY SEMICONDUCTOR SOLUTIONS CORP

5 patents

KAGAWA YOSHIHISA

4 patents

JAPAN SERVO

2 patents

SONY GROUP CORP

2 patents

TOKYO ELECTRON LTD

2 patents

FUJII NOBUTOSHI

1 patent

NIDEC SERVO CORP

1 patent

MITSUBISHI ELECTRIC CORP

1 patent