Inventor

WANG CHUEI-TANG

TW230 patents

⚠️ This page may combine multiple inventors who share the name “WANG CHUEI-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

43 patents

US9831148B2Nov 28, 2017

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD104 citations99

US10504835B1Dec 10, 2019

Package structure, semiconductor chip and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD64 citations98

US10162139B1Dec 25, 2018

Semicondcutor package

TAIWAN SEMICONDUCTOR MFG CO LTD96 citations98

US10153239B2Dec 11, 2018

Antennas and waveguides in InFO structures

TAIWAN SEMICONDUCTOR MFG CO LTD59 citations97

US10267990B1Apr 23, 2019

Hybrid interconnect device and method

TAIWAN SEMICONDUCTOR MFG CO LTD33 citations94

US10157834B1Dec 18, 2018

Electronic apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD24 citations94

US9431369B2Aug 30, 2016

Antenna apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD29 citations94

US10163852B2Dec 25, 2018

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations92

US9407184B2Aug 2, 2016

Energy harvesting device

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92

US11587916B2Feb 21, 2023

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations86

US11424197B2Aug 23, 2022

Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations86

US11282816B2Mar 22, 2022

Memory packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86

US11244939B2Feb 8, 2022

Package structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86

US10867938B2Dec 15, 2020

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations86

US10777518B1Sep 15, 2020

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations86

US10371893B2Aug 6, 2019

Hybrid interconnect device and method

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations86

US11315891B2Apr 26, 2022

Methods of forming semiconductor packages having a die with an encapsulant

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations85

US11362077B2Jun 14, 2022

Photonic semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US11211360B2Dec 28, 2021

Passive device module, semiconductor package including the same, and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84

US10962711B2Mar 30, 2021

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US10796990B2Oct 6, 2020

Semiconductor structure, package structure, and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84

US10770795B2Sep 8, 2020

Antenna device and method for manufacturing antenna device

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US10763164B2Sep 1, 2020

Package structure with inductor and method of forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10679947B2Jun 9, 2020

Chip package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84

US10672728B2Jun 2, 2020

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84

US10510679B2Dec 17, 2019

Semiconductor device with shield for electromagnetic interference

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10497668B2Dec 3, 2019

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US10481351B2Nov 19, 2019

Semicondcutor packages

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10269732B2Apr 23, 2019

Info package with integrated antennas or inductors

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84

US10134708B2Nov 20, 2018

Package with thinned substrate

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84

US10115685B2Oct 30, 2018

Method of manufacturing a semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84

US10074472B2Sep 11, 2018

InFO coil on metal plate with slot

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84

US10050013B2Aug 14, 2018

Packaged semiconductor devices and packaging methods

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US10043761B2Aug 7, 2018

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US9953936B2Apr 24, 2018

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US9893042B2Feb 13, 2018

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US9818722B1Nov 14, 2017

Package structure and method for manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US9735118B2Aug 15, 2017

Antennas and waveguides in InFO structures

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84

US9406648B2Aug 2, 2016

Power supply arrangement for semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84

US11488909B2Nov 1, 2022

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83

US10734323B2Aug 4, 2020

Package structures

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83

US10366966B1Jul 30, 2019

Method of manufacturing integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83

US9537205B2Jan 3, 2017

3D antenna for integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations82

TAIWAN SEMICONDUCTOR MFG

5 patents

US9373605B1Jun 21, 2016

DIE packages and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG30 citations94

US9396300B2Jul 19, 2016

Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof

TAIWAN SEMICONDUCTOR MFG20 citations92

US9337073B2May 10, 2016

3D shielding case and methods for forming the same

TAIWAN SEMICONDUCTOR MFG17 citations92

US9252491B2Feb 2, 2016

Embedding low-k materials in antennas

TAIWAN SEMICONDUCTOR MFG11 citations92

US9082761B2Jul 14, 2015

Polymer layers embedded with metal pads for heat dissipation

TAIWAN SEMICONDUCTOR MFG5 citations84

WANG CHUEI-TANG

1 patent

US8872312B2Oct 28, 2014

EMI package and method for making same

WANG CHUEI-TANG24 citations89

KUO FENG WEI

1 patent

US9275950B2Mar 1, 2016

Bead for 2.5D/3D chip packaging application

KUO FENG WEI8 citations84

Showing the top 50 of 230 patents by PatentIndex Score.