Inventor
MIYAZAWA EMI
JP7 patents
⚠️ This page may combine multiple inventors who share the name “MIYAZAWA EMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RESONAC CORP
5 patentsUS12084599B2Sep 10, 2024
Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
RESONAC CORP2 citations67
US12543538B2Feb 3, 2026
Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method
RESONAC CORP0 citations59
US12581907B2Mar 17, 2026
Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device
RESONAC CORP0 citations56
US12165882B2Dec 10, 2024
Semiconductor device manufacturing method
RESONAC CORP0 citations47
US12538751B2Jan 27, 2026
Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing
RESONAC CORP0 citations46