Inventor

FURUTANI RYOJI

JP6 patents

⚠️ This page may combine multiple inventors who share the name “FURUTANI RYOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANAKA MAIKO

2 patents

US8470115B2Jun 25, 2013

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

TANAKA MAIKO8 citations81

US8465615B2Jun 18, 2013

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

TANAKA MAIKO8 citations81

KATOU RIE

1 patent

US8975161B2Mar 10, 2015

Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method

KATOU RIE6 citations67

FURUTANI RYOJI

1 patent

US9011624B2Apr 21, 2015

Adhesive sheet and method for manufacturing adhesive sheets

FURUTANI RYOJI2 citations52

RESONAC CORP

1 patent

US12538751B2Jan 27, 2026

Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing

RESONAC CORP0 citations46

HITACHI CHEMICAL CO LTD

1 patent

US10825694B2Nov 3, 2020

Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection

HITACHI CHEMICAL CO LTD0 citations42