Inventor
WU J Y
TW9 patents
Patents
9 patentsUS5968610AOct 19, 1999
Multi-step high density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP371 citations98
US6100205AAug 8, 2000
Intermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP27 citations92
US5944593AAug 31, 1999
Retainer ring for polishing head of chemical-mechanical polish machines
UNITED MICROELECTRONICS CORP64 citations91
US5517062AMay 14, 1996
Stress released VLSI structure by the formation of porous intermetal layer
UNITED MICROELECTRONICS CORP6 citations73
US5393709AFeb 28, 1995
Method of making stress released VLSI structure by the formation of porous intermetal layer
UNITED MICROELECTRONICS CORP14 citations73
US5358733AOct 25, 1994
Stress release metallization for VLSI circuits
UNITED MICROELECTRONICS CORP17 citations73
US5254495AOct 19, 1993
Salicide recessed local oxidation of silicon
UNITED MICROELECTRONICS CORP9 citations73
US5292680AMar 8, 1994
Method of forming a convex charge coupled device
UNITED MICROELECTRONICS CORP4 citations62
US7514014B1Apr 7, 2009
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP2 citations59